News

Electronic components printed on substrats with 1,4 μm thickness

18.04.2017

An interdisciplinary research group prints electronic circuits on thin films. These innovative thermoelectric generators (TEG) convert heat directly into electric power as soon as there is a condition of differences in temperature.

GERMAN BMBF REPORT

TRISENSE: Call for applications

13.04.2017

The internationalization program TRISENSE (Global Triangle for Sensor Nodes) was launched at January 2017. Core are joint R&D projects with InnovationLab associates and members of NextFlex (US) and CASE (Korea). Get involved and apply with your idea! Successful candidates can look forward to public funding and R&D cooperations with high-potential partners.

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InnovationLab presented demonstrator for 'e-health' at LOPEC 2017, Munich

11.04.2017

InnovationLab GmbH presented the new developed product OccluSense® by Bausch with integrated flexible printed pressure sensors by InnovationLab. It combines the traditional and digital occlusion control to represent the pressure distribution on occlusal surfaces.

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InnovationLab GmbH at LOPEC 2017, Munich

16.03.2017

At LOPEC 2017 BASF New Business GmbH and InnovationLab GmbH will exhibit on a common booth and present a jointly designed, developed and manufactured demonstrator for ,smart packaging’.
This demonstrator highlights the benefits of flexible and lightweight electronics.

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