With the help of the funding from the excellence cluster competition, numerous future-oriented research projects are being implemented in the Forum Organic Electronics cluster, which will have a decisive impact on the progress of development of new technologies.
In this project, new materials, concepts, components, manufacturing processes and software for printed organic circuits with integrated sensors are to be developed for applications in the packaging sector. In the future, these systems could be used as printed "smart labels". "Smart labels" are intelligent and flexible transponders which, together with their antennas, are applied to a film and which can transmit information. Their main use is in the logistics and packaging sector.
BASF SE, Robert Bosch GmbH, Merck KGaA, Pepperl + Fuchs GmbH, SAP AG, PolyIC GmbH & Co. KG, TU Darmstadt, Heidelberg University, Hochschule Mannheim You can find detailed information on the project here. You can find the press release on this project here.
