Product & Process Development Services

The interdisciplinary field of organic and printed electronics requires deep knowledge across multiple domains. A solid understanding of materials, processes, and printing technologies is essential for the development of flexible and hybrid electronic systems.

We offer state-of-the-art infrastructure along with extensive expertise in order to develop novel products.
Our offerings are extended by the knowhow of our excellent partner network consisting of companies and research institutes such as BASF SE, Karlsruhe Institute of Technology, and Heidelberg University.

Planning & Design

We assist clients through various stages of product development. This includes services such as:

  • designing of printing and masking layouts
  • process development
  • proof of concept
  • rapid prototyping
  • feasibility studies 

Printing & Coating

Printing and coating techniques are among our core competences. Choosing the best suitable combination of functional materials, substrates, and deposition methods is a major aspect of our process development. The existing expertise and infrastructure at InnovationLab includes the following: 

Methods:

  • inkjet printing
  • screen printing
  • gravure printing
  • flexographic printing
  • spray deposition
  • doctor blading
  • vacuum deposition
  • hot embossing
  • slot-die coating

Functional materials:

  • organic semiconductors and nanomaterials
  • (transparent) conductive inks
  • force and temperature sensitive materials
 

Fluid and film characterization: 

  • ink rheology
  • film thickness
  • surface roughness
  • sheet resistance

Substrates:

rigid:

  • glass
  • ITO-glass
  • silicon

flexible:

  • PET, PEN, PI
  • ITO-PET, ITO-PEN
  • flexible glass

Pre-/Post Processing

In order to obtain the desired film characteristics, various pre- and post processing methods are employed. Among the most common ones are:

patterning:

  • e.g. lithographic, inkjet masking

substrate pretreatment:

  • UV-ozon, O2-/Ar-plasma, tuning adhesion properties

surface treatment/modification:

  • self-assembled monolayers (SAM)
  • polymeric dipole layers (PDL)

drying/Curing:

  • IR, thermal, vacuum, photonic sintering, UV-curing

encapsulation/Lamination

Integration

Beyond the development and fabrication of printed electronic components, we are concerned with the integration of such components into circuits and systems. Some of the key topics involved in the realization of organic/inorganic hybrid systems are listed below:

  • integration of printed thin film transistors, sensors, and energy harvesting devices with traditional components
  • printed interconnect solutions
  • smart flexible systems